US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,826, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Kuan-Jung Chen (Hsinchu, Taiwan), I-Chih Chen (Tainan, Taiwan), Chih-Mu Huang (Tainan, Taiwan), Kai-Di Wu (Tainan, Taiwan), Ming-Feng Lee (Hsinchu, Taiwan) and Ting-Chun Kuan (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin a...