US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,055, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of fabricating the same" was invented by Hao-Jan Pei (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan), Wei-Yu Chen (Taipei, Taiwan), Chia-Shen Cheng (Hsinchu County, Taiwan), Chih-Chiang Tsao (Taoyuan, Taiwan), Jen-Jui Yu (Taipei, Taiwan) and Cheng-Shiuan Wong (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plura...