US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 24 for "Micro-electro mechanical system and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,362, issued on Feb. 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Micro-electro mechanical system and manufacturing method thereof" was invented by Ting-Li Yang (Tainan, Taiwan), Kai-Di Wu (Tainan, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Wen-Hsiung Lu (Tainan, Taiwan), Cheng Jen Lin (Kaohsiung, Taiwan) and Chin Wei Kang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, throug...