US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Methods for fabricating semiconductor structures having transistor arrays with different pitches" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,986, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods for fabricating semiconductor structures having transistor arrays with different pitches" was invented by Chia-Ling Wu (Tainan, Taiwan), Ru-Shang Hsiao (Jhubei, Taiwan), I-Shan Huang (Tainan, Taiwan), Ying Hsin Lu (Tainan, Taiwan) and Tsung-Jui Wu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a method for fabricating semiconductor structures having transistor arrays with different pitches. The method can include forming a first and second arrays of structures on a semiconductor substrate. T...