US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Method for forming an isolation structure having multiple thicknesses to mitigate damage to a display device" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,893, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for forming an isolation structure having multiple thicknesses to mitigate damage to a display device" was invented by Yung-Chang Chang (Taipei City, Taiwan) and Ming Chyi Liu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to a method of forming a display device, comprising: forming a first reflector electrode and a second reflector electrode over an interconnect structure, wherein the first reflector electrode is laterally separated from the second reflector electrod...