US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "MEMS microphone and MEMS accelerometer on a single substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,360, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"MEMS microphone and MEMS accelerometer on a single substrate" was invented by Chun-Wen Cheng (Zhubei, Taiwan), Chia-Hua Chu (Zhubei, Taiwan), Chun Yin Tsai (Hsinchu, Taiwan) and Wen Cheng Kuo (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS)...