ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,057, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Chiplet interposer" was invented by Shang-Yun Hou (Jubei, Taiwan), Weiming Chris Chen (Hsinchu, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan), Hsien-Pin Hu (Zhubei, Taiwan), Wen-Chih Chiou (Zhunan Township, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include packages and methods for forming packages which include interposers having a substrate made of a dielectric material. The interposers may also include a redistribution structure over the substrate which includes metallization patterns which ...