US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Semiconductor package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,681, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of manufacturing the same" was invented by Shih-Wei Chen (Hsinchu, Taiwan), Chih-Hua Chen (Hsinchu County, Taiwan), Hsin-Yu Pan (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Lipu Kris Chuang (Hsinchu, Taiwan) and Tin-Hao Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution structure, at least one semiconductor device, a heat dissipation component, and an encapsulating material. The at least one semiconductor device is disposed on and electrically c...