US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Semiconductor device, electronic device including the same, and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,710, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device, electronic device including the same, and manufacturing method thereof" was invented by Kuan-Yu Huang (Taipei, Taiwan), Sung-Hui Huang (Yilan County, Taiwan) and Shang-Yun Hou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a circuit substrate, a semiconductor package, connective terminals and supports. The circuit substrate has a first side and a second side opposite to the first side. The semiconductor package is connected to the first side of the circuit substrate. The connec...