US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Optical connection structures for a photonic assembly and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,080, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Optical connection structures for a photonic assembly and methods for forming the same" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Hsing-Kuo Hsia (Jhubei, Taiwan), Chih-Wei Tseng (Hsinchu, Taiwan), Jiun Yi Wu (Zhongli, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan) and Jui Lin Chao (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic assembly includes: a composite die including a photonic integrated circuits (PIC) die and an electronic integrated circuits (EIC) die, the PIC die including waveguides and photonic devices therein,...