US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Interconnect structures in integrated circuit chips" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,939, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interconnect structures in integrated circuit chips" was invented by Meng-Han Wang (Hsinchu, Taiwan), Yu-Ting Lin (Hsin-Chu, Taiwan), Chia Hong Lin (Hsinchu County, Taiwan), Kao Chih Liu (Changhua County, Taiwan) and Wei-Cheng Liu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) chip package and a method of fabricating the same are disclosed. The IC chip package includes a device layer on a first surface of a substrate, a first interconnect structure on the device layer, and a second interconnect st...