US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 17 for "Integrated circuit structure and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,365, issued on Feb. 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit structure and method for fabricating the same" was invented by Ting-Jung Chien (Nantou County, Taiwan), Jiun-Ming Kuo (Taipei, Taiwan), Shih-Hao Fu (Taoyuan, Taiwan), Yuan-Ching Peng (Hsinchu, Taiwan) and Yen-Po Lin (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating an integrated circuit structure is provided. The method includes forming an epitaxial stack over a semiconductor substrate, wherein the epitaxial stack comprises a plurality of first epitaxial layers and a plurality of second ...