US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Semiconductor structure and method for manufacturing the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,769, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for manufacturing the same" was invented by Zhi-Ren Xiao (Hsinchu County, Taiwan), Nuo Xu (San Jose, Calif.), Chih-Ching Wang (Kinmen County, Taiwan), Jon-Hsu Ho (New Taipei City, Taiwan), Chung-Wei Wu (Ju-Bei City, Taiwan) and Zhiqiang Wu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, nanostructures, source/drain features, a gate structure, and inner spacers. The nanostructures are over the substrate and spaced apart from each other in a Z-directi...