US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Semiconductor packages and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,939, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages and methods of manufacturing thereof" was invented by Lung-Kai Mao (Kaohsiung City, Taiwan), Wen-Hsiung Lu (Tainan City, Taiwan), Pei-Wei Lee (Pingtung County, Taiwan), Szu-Hsien Lee (Tainan City, Taiwan) and Chieh-Ning Feng (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a die having a plurality of devices over a first substrate, where the first substrate includes a dopant at a first concentration and the first substrate has a first width along a horizontal direction. The...