US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Semiconductor devices with embedded silicon lens" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,699,223, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices with embedded silicon lens" was invented by Feng-Wei Kuo (Zhudong Township, Taiwan) and Wen-Shiang Liao (Toufen Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a silicon substrate having a first region and a second region. The semiconductor device includes a silicon lens formed in the first region and along a surface of the silicon substrate on a first side of the silicon substrate. The semiconductor device includes a photonic die disposed in the first region and on a second side ...