US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Semiconductor device structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,932, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device structure and manufacturing method thereof" was invented by Kun-Yen Liao (Taipei, Taiwan), Ming-Hsien Lin (Hsinchu County, Taiwan), Yung-Chih Wang (Taoyuan, Taiwan), Hsin-Ping Chen (Hsinchu County, Taiwan), Tsu-Chun Kuo (Hsinchu County, Taiwan), Meng-Pei Lu (Hsinchu, Taiwan) and Cheng-Chin Lee (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method for a semiconductor device structure and the semiconductor device structure are disclosed. The method includes forming backside connection structures by ...