US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Semiconductor device and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,755, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of forming the same" was invented by Yi-Ruei Jhan (Keelung City, Taiwan), Kuan-Ting Pan (Taipei City, Taiwan), Yu-Wei Lu (Taipei City, Taiwan), Shi-Ning Ju (Hsinchu City, Taiwan), Kuo-Cheng Chiang (Hsinchu County, Taiwan) and Chih-Hao Wang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor device and a method of forming the same. The semiconductor device includes a semiconductor device. The semiconductor device includes a substrate including a plurality of fins, a plura...