US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Mitigating pattern collapse" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,975, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Mitigating pattern collapse" was invented by Chih-Yuan Ting (Taipei City, Taiwan), Ya-Lien Lee (Baoshan Township, Taiwan), Chung-Wen Wu (Zhubei City, Taiwan) and Jeng-Shiou Chen (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One or more techniques or systems for mitigating pattern collapse are provided herein. For example, a semiconductor structure for mitigating pattern collapse is formed. In some embodiments, the semiconductor structure includes an extreme low-k (ELK) dielectric region associated with a via or a metal line...