ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,051, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Integrated circuit packages and methods" was invented by Yi-Hsiu Chen (Hsinchu, Taiwan), Chia-Fang Tsai (Hsinchu, Taiwan), Ming-Yun Liao (Taoyuan City, Taiwan) and Yu-Chian Chiang (Kaohsiung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package and the method of forming the same are provided. The integrated circuit package may include a first die having a first substrate and a first through via extending through the first substrate, a first gap-fill layer along a sidewall of the first substrate, an isolation layer...