US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "High-density microbump arrays with enhanced adhesion and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,043, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"High-density microbump arrays with enhanced adhesion and methods of forming the same" was invented by Yen-Kun Lai (New Taipei City, Taiwan), Yi-Wen Wu (Xizhi City, Taiwan), Kuo-Chin Chang (Chiayi City, Taiwan), Po-Hao Tsai (Zhongli City, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die may include metal interconnect structures located within interconnect-level dielectric material layers, bonding pads located on a topmost interconnect-level dielectric material layer, a dielectric pass...