US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Frame edge reinforcement structure for package structures and methods of using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,052, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Frame edge reinforcement structure for package structures and methods of using the same" was invented by Chin-Hua Wang (New Taipei City, Taiwan), Tsung-Yen Lee (Hemei Township, Taiwan), Cong-Wei Yang (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device structure includes: an interposer including interposer dielectric material layers having formed therein interposer metal interconnect structures and die-side interposer bonding pads; at least one semiconductor die having formed therein in...