US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Systems and methods for shuttered wafer cleaning" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,091, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Systems and methods for shuttered wafer cleaning" was invented by Tsui-Wei Wang (Hsinchu City, Taiwan), Yung-Li Tsai (Houlong Town, Taiwan) and Chui-Ya Peng (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter...