US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor structures with through via" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,138, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structures with through via" was invented by Ke-Gang Wen (Hsinchu County, Taiwan), Kuan-Hsun Wang (Hsinchu City, Taiwan), Tsung-Chieh Hsiao (Changhua County, Taiwan), Liang-Wei Wang (Hsinchu City, Taiwan), Dian-Hau Chen (Hsinchu, Taiwan) and Hsin-Feng Chen (Yilan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a device layer over the substrate, an interconnect structure over the device layer, and a first plurality of through vias and a second plurality of through vias ex...