US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device with supporting structures and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,846, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device with supporting structures and method for forming the same" was invented by Yi-Huan Chen (Hsinchu City, Taiwan), Chien-Chih Chou (New Taipei City, Taiwan), Yu-Chang Jong (Hsinchu City, Taiwan) and Jhu-Min Song (Nantou County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device comprises an insulating structure, a dielectric structure, a metal structure, a conductive spacer and a dielectric spacer. The die...