US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,140, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and methods of forming the same" was invented by Liang-Hsuan Peng (Taipei, Taiwan), Chih-Hung Lu (Hsinchu, Taiwan), Chih-Lin Wang (Hsinchu, Taiwan) and Song-Bor Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure, along with methods of forming such, are described. The structure includes an interconnect structure disposed over a substrate, a first conductive feature disposed in the interconnect structure, a dielectric layer disposed on the interconnect structure, an...