US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Semiconductor device and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,176, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and methods of manufacture" was invented by Min-Chien Hsiao (Taichung City, Taiwan), Chao-Wen Shih (Zhubei City, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan) and Yen-Ming Chen (Chu-Pei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and methods of manufacture are discussed herein. A device includes a first semiconductor package including a first semiconductor die encapsulated in an insulating material, a first thermal expansion resistant layer over the first semiconductor die, a bonding layer o...