US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Methods of forming packages and resulting structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,220, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods of forming packages and resulting structures" was invented by Chien-Fu Tseng (Taipei City, Taiwan), Yu Chieh Yung (Hsinchu, Taiwan), Cheng-Hsien Hsieh (Kaohsiung City, Taiwan), Hung-Pin Chang (New Taipei City, Taiwan), Li-Han Hsu (Hsinchu, Taiwan), Wei-Cheng Wu (Hsinchu, Taiwan) and Der-Chyang Yeh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Manufacturing flexibility and efficiency are obtained with a method, and resulting structure, in which RDL contact features can be formed and aligned to through silicon vias (TSV's) ...