US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Method for manufacturing semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,076, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for manufacturing semiconductor structure" was invented by Wen-Yen Chen (Hsinchu, Taiwan), Tsai-Yu Huang (Taoyuan City, Taiwan) and Chi On Chui (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor structure is provided. The method includes forming a transistor over the first wafer; bonding a first wafer to a second wafer; trimming an edge region of the first wafer along a circular trimming path, wherein a center of the circular trimming path is offset from a center of the second...