US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,194, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Ming-Fa Chen (Taichung City, Taiwan), Yun-Han Lee (Baoshan Township, Taiwan) and Lee-Chung Lu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit packages and methods of forming the same are provided. In an embodiment, a device includes: a power distribution interposer including: a first bonding layer; a first die connector in the first bonding layer; and a back-side interconnect structure including a power rail connected to the first die con...