ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,219, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Integrated circuit package and method" was invented by Chih-Wei Wu (Zhuangwei Township, Taiwan), Ching-Feng Yang (Taipei, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan), An-Jhih Su (Taoyuan, Taiwan) and Wen-Chih Chiou (Zhunan Township, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes forming a first bonding layer over a substrate of a first wafer, the first wafer including a first semiconductor die and a second semiconductor die, performing a first dicing process to form two grooves that e...