US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Ceramic article, semiconductor apparatus for manufacturing a semiconductor structure and method of manufacturing a ceramic article" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,715,816, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Ceramic article, semiconductor apparatus for manufacturing a semiconductor structure and method of manufacturing a ceramic article" was invented by Ren-Guan Duan (Hsinchu, Taiwan), Li-Chun Wang (Hsinchu City, Taiwan), Chen-Hsiang Lu (Hsin-Chu City, Taiwan) and Tien-Chih Cheng (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A ceramic article includes a ceramic body including a spinel (MgAl2O4) structure, wherein a ratio of a density of the spinel structure to a theoretical density of a spinel is greater than 99.5%. A semico...