US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Bump-on-trace design for enlarge bump-to-trace distance" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,206, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-chu, Taiwan).

"Bump-on-trace design for enlarge bump-to-trace distance" was invented by Sheng-Yu Wu (Hsinchu, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan) and Chen-Shien Chen (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a first and a second package component. The first package component includes a first metal trace and a second metal trace at the surface of the first package component. The second metal trace is parallel to the first metal trace. The second metal trace includes a narrow metal trace portion having a first width...