US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Benchmark circuit on a semiconductor wafer and method for operating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,941, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Benchmark circuit on a semiconductor wafer and method for operating the same" was invented by Chu-Feng Liao (Hsinchu, Taiwan), Hung-Ping Cheng (Chiayi City, Taiwan), Yuan-Yao Chang (Kaohsiung City, Taiwan) and Shuo-Wen Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies, and a benchmark circuit disposed on the scribe line. The benchmark circuit includes a first switch...