US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Wafer thinning method having feedback control" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,859, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Wafer thinning method having feedback control" was invented by Yuan-Hsuan Chen (Tainan City, Taiwan), Kei-Wei Chen (Tainan City, Taiwan), Ying-Lang Wang (Tien-Chung Village, Taiwan) and Kuo-Hsiu Wei (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of thinning a wafer includes measuring an initial thickness of the wafer. The method further includes calculating a polishing time using the initial thickness. The method further includes polishing the wafer for a first duration equal to the polishing time to obtain a poli...