US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 18 for "Systems and methods for semiconductor wafer transport" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,871, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Systems and methods for semiconductor wafer transport" was invented by Wen-Hao Cheng (Hsinchu, Taiwan), Hsuan-Chih Chu (Hsinchu, Taiwan) and Yen-Yu Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a movable blade having a first surface to receive a semiconductor wafer. The device can include a positional sensor to detect a position of the semiconductor wafer on a surface of the movable blade, relative to a stationary body. The movable blade can be configured to move relative to the stationary body to cause a d...