US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "System and method for cleaning a wafer surface" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,876, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"System and method for cleaning a wafer surface" was invented by Chi-hsiang Shen (Tainan, Taiwan), Te-Chien Hou (Kaohsiung, Taiwan), Jeng-Chi Lin (Hsinchu, Taiwan), Tang-Kuei Chang (Tainan, Taiwan), Chen-Hsueh Lin (Kaohsiung, Taiwan), Da-Shiuan Chiou (Taipei, Taiwan), Yu-Jen Shen (Hsinchu, Taiwan), Hui-Chi Huang (Hsinchu, Taiwan) and Kei-Wei Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate cleaning system is provided. The substrate cleaning system includes: a substrate chuck configured to hold a substrate during ...