US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 18 for "Multi-TIM packages and method forming same" (Taiwanese, Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,909, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Multi-TIM packages and method forming same" was invented by Ping-Yin Hsieh (Hsinchu, China), Pu Wang (Hsinchu, Taiwan), Li-Hui Cheng (New Taipei City, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component...