US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Conductive structure in semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,893, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Conductive structure in semiconductor structure and method for forming the same" was invented by Cai-Ling Wu (Hsinchu, Taiwan), Hsiu-Wen Hsueh (Taichung City, Taiwan), An-Jiao Fu (Taipei City, Taiwan), Chii-Ping Chen (Hsinchu City, Taiwan) and Jen-Hung Wang (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor structure is provided. The semiconductor structure includes an aluminum-containing layer and an etch stop layer formed over the aluminum-containing layer. The semiconductor structu...