ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,653, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Thick redistribution layer features" was invented by Chia-Feng Cheng (Tainan City, Taiwan), Kang-Yi Lien (Tainan City, Taiwan) and Chia-Ping Lai (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor structures and method of forming the same are provided. A semiconductor structure according to the present disclosure includes a metal feature in a dielectric layer, a passivation structure over the dielectric layer and the metal feature, a contact pad over the passivation structure, and a plurality of contact vias exte...