ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,704,525, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Testing apparatus and method of using the same" was invented by Jian-Ting Chen (Hsinchu County, Taiwan), Cheng-Han Huang (Hsinchu, Taiwan) and Kuang-Hua Wang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically ...