US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,976, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging" was invented by Kuen-Shian Chen (Hsin-Chu, Taiwan) and Chien-Li Kuo (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structures and methods for reducing thermal expansion mismatch during chip scale packaging are disclosed. In one example, a semiconductor structure is disclosed. The semiconductor structure includes a first metal layer over a substrate, a dielectric region, and a polymer region. The first metal layer comprises a fi...