US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,021, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Manikandan Arumugam (Tainan, Taiwan), Tsung-Yi Yang (Tainan City, Taiwan), Chien-Chih Chen (Tainan, Taiwan), Mu-Han Cheng (Tainan, Taiwan) and Kuo-Hsien Cheng (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first conductive structure disposed within a first layer of the semiconductor structure. The semiconductor structure includes a dielectric s...