US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor structure, integrated circuit and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,704,476, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure, integrated circuit and manufacturing method thereof" was invented by I-Che Lee (Hsinchu, Taiwan), Huai-Ying Huang (New Taipei City, Taiwan), Yen-Chieh Huang (Hsinchu, Taiwan), Kai-Wen Cheng (Taichung City, Taiwan), Yu-Ming Lin (Hsinchu City, Taiwan) and Chung-Te Lin (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is disclosed. The semiconductor structure includes a semiconductor substrate, a hydrogen sensing stacked layer disposed over the semiconductor substrate, and a protect...