US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor devices including backside capacitors and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,963, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices including backside capacitors and methods of manufacture" was invented by Chih-Chao Chou (Hsinchu, Taiwan), Yi-Hsun Chiu (Zhubei City, Taiwan), Shang-wen Chang (Jhubei City, Taiwan), Ching-Wei Tsai (Hsinchu, Taiwan), Chih-Hao Wang (Baoshan Township, Taiwan) and Min Cao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including backside capacitors and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first transistor structure; a front-side inter...