US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor device including cross-die bonding ring and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,046, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device including cross-die bonding ring and methods for forming the same" was invented by Chen-Shien Chen (Zhubei City, Taiwan), Chih-Hong Wang (Taipei City, Taiwan), Ting Hao Kuo (Hsinchu City, Taiwan) and Yu-Chia Lai (Zhunan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes lower dies separated by a dielectric region; a cross die vertically stacked on the lower dies and the dielectric region; a molding structure filling the dielectric region and surrounding side surfaces of the lower dies ...