ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,966, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Chih-Chien Pan (Taipei City, Taiwan), Pu Wang (Hsinchu City, Taiwan), Li-Hui Cheng (New Taipei City, Taiwan) and Ying-Ching Shih (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the sec...