US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method of manufacturing 3DIC package comprising a plurality of discrete device dies bonding to a wafer" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,039, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of manufacturing 3DIC package comprising a plurality of discrete device dies bonding to a wafer" was invented by Ching-Yu Huang (Hsinchu, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan) and Ting-Chu Ko (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first device die to a second device die through face-to-face bonding, wherein the second device die is in a device wafer, forming a gap-filling region to encircle the first device die, performing a backside-grinding process on the device wafer to reveal a t...