US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method and structure for a three-dimensional package" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,045, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method and structure for a three-dimensional package" was invented by Chao-Wen Shih (Zhubei, Taiwan), Min-Chien Hsiao (Taichung, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan), Yen-Ming Chen (Chu-Pei, Taiwan), Ashish Kumar Sahoo (Hsinchu, Taiwan), Chen-Sheng Lin (Taoyuan, Taiwan) and Hsin-Yu Pan (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include methods of forming three-dimensional packages and the packages resulting therefrom. The packages may utilize a bridge die to electrically connect one die to another die and at l...