US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Manufacturing method of semiconductor package including cutting heat dissipation sheet into a plurality of heat dissipation films" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,969, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Manufacturing method of semiconductor package including cutting heat dissipation sheet into a plurality of heat dissipation films" was invented by Ting-Yu Yeh (Hsinchu, Taiwan), Cing-He Chen (Taoyuan City, Taiwan), Kuo-Chiang Ting (Hsinchu City, Taiwan), Weiming Chris Chen (Taipei City, Taiwan) and Chia-Hao Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor package includes the following steps. An encapsulated semiconductor package is provided on a substrate. A heat dissipation sheet is cu...