US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Interconnect structure for front-to-front stacked chips" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,048, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Interconnect structure for front-to-front stacked chips" was invented by Tsung-Chieh Hsiao (Changhua County, Taiwan), Yi Ling Liu (Hsinchu City, Taiwan), Ke-Gang Wen (Hsinchu, Taiwan), Yu-Bey Wu (Hsinchu, Taiwan) and Liang-Wei Wang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interconnect structures for front-to-front stacked chips/dies and methods of fabrication thereof are disclosed herein. An exemplary system on integrated circuit (SoIC) includes a first die that is front-to-front bonded with a second die, for exampl...